Fine Ceramic Plus (F+) provides end‑to‑end ceramic module manufacturing that integrates powder formulation, forming, debinding and sintering, precision machining, surface engineering, and high‑temperature bonding. We turn concept designs into reliable, mass‑producible modules for front‑end semiconductor equipment, vacuum and precision machinery, metrology/inspection, and optics—balancing performance, cost, and lead time with verifiable engineering data.

Scope of Work

  • Ceramic bases / carrier platforms: Functional modules for heating, adsorption, and precision positioning.

  • Microporous vacuum platforms: Application‑specific pore‑size distributions and zoned patterns for stable, mark‑free handling.

  • ESC / heater‑module peripherals: Electrode‑layer fabrication, interface bonding, functional coatings, refurbishment, and upgrades.

  • Special functional parts: Conductive / ESD‑controlled, wear‑ and corrosion‑resistant, and optical‑protection composite components.

Core Capabilities & Processes

  • Powders & formulations: Tailored phase composition and particle‑size distributions to balance mechanical, thermal, and electrical properties.

  • Forming: Cold isostatic pressing (CIP) and mold‑based routes supporting thin‑wall designs and complex geometries.

  • Debinding & sintering: Multi‑segment thermal profiles manage shrinkage and grain growth; full profile records enable batch traceability.

  • Precision machining: Grinding, lapping, polishing, and micro‑feature fabrication for tight tolerances and superior surface quality.

  • Surface engineering: Polishing, etching, coatings, and surface modification to enhance durability, cleanliness, wetting behavior, or electrical properties.

  • High‑temperature bonding / co‑firing: Pre‑sintered bonding (sandwich) and co‑firing to integrate functional layers and electrodes.

  • Metrology & validation: Density, hardness, flexural strength, resistivity, thermal conductivity, surface roughness (Ra/Sa), and microstructural analysis to close the loop from design to finished parts.

Materials & Specification Options

  • Material systems: ZTA, SiC, AlN, YAG, and other engineering ceramics; conductive / ESD‑controlled composite formulations.

  • Geometries & sizes: Large platforms and thin parts supported; custom flatness, parallelism, and surface‑roughness specifications.

  • Microporous design: Configurable pore‑size distributions, stepped pores, and zoned adsorption, balancing suction performance and strength.

  • Surface properties: Hydrophilic/hydrophobic tuning, contamination resistance, corrosion/wear protection, and other functional finishes.

Co‑Design (DFM / DOE)

We engage at requirement definition and co‑develop material selection, structural design, process routing, and fixturing. DOE shortens iterations and isolates key factors; DFM ensures manufacturability. We support prototyping, durability testing, and failure analysis (FA) so decisions remain data‑backed and traceable throughout the program.

Quality & Documentation

Three‑tier QA (incoming / in‑process / outgoing), with sample retention and serial traceability. Engineering change (EC) and first article inspection (FAI) are milestone‑managed. We deliver comprehensive metrology reports, process records, and key‑material BOMs/routings to maintain consistency from samples through mass production.

Typical Applications

Platforms and carriers for etch, thin‑film, and ion processes; CMP peripherals; vacuum‑transfer and positioning jigs; precision‑metrology fixtures; optical windows and protective structures.

Engagement Process

RFQ & NDA → requirement clarification & spec freeze → feasibility assessment & quotation → sampling & validation → pilot builds → mass‑production ramp → maintenance, refurbishment, and upgrade support. We provide milestone plans, risk assessments, and validation matrices end‑to‑end, and cooperate with incoming‑material qualification within your system.

Delivery & Local Support

Centering on our Hsiangshan (Hsinchu) site, we leverage localized supply and flexible capacity to support low‑volume/high‑mix builds, fast iterations, and redundancy plans. We also offer module refurbishment and localized alternatives to reduce maintenance cost and lead‑time risk.

Call to Action

If you require ceramic heating/adsorption platforms, microporous vacuum fixtures, ESC‑related modules, or functional ceramic components, contact F+. Share target specifications, operating environment, and key dimensions/tolerances, and we will propose data‑driven, manufacturable solutions to accelerate your product introduction.