Ceramic Module Repair / Optimization

Fine Ceramic Plus (F+) provides repair, regeneration, and performance optimization services for ceramic modules used in front‑end semiconductor processes and precision vacuum equipment. Grounded in materials science and supported by engineering data, we cover the full chain—from failure analysis and structural repair to functional adjustment and final validation. Our goal is to help customers minimize downtime, control costs, restore module stability, and extend product lifecycle.

Service Scope

  • Surface regeneration and precision finishing: Grinding, lapping, and polishing to restore flatness, parallelism, and surface roughness; removal of scratches, particles, and contamination residues.

  • Interface re‑bonding: High‑temperature re‑bonding to resolve delamination, voids, and thermal‑cycle fatigue.

  • Electrode and conductive‑layer renewal: Rebuilding electrode layers, repairing shielding layers, and optimizing interface resistance for heating, adsorption, or measurement applications.

  • Sealing and leak repair: Re‑machining sealing surfaces, O‑ring grooves, and path repairs, verified with helium mass spectrometer leak testing.

  • Microporous surface cleaning and recovery: Decontamination, unclogging, and polishing of microporous work surfaces to restore stable and uniform adsorption performance.

  • Thermal uniformity and response tuning: Optimization of heating profiles, adjustment of sensor placement, and fine‑tuning feedback parameters to reduce thermal lag and improve uniformity.

  • Clamping / adsorption performance recovery: Calibration and testing of ESC or vacuum platforms to restore stable clamping and holding capacity.

  • Functional coating renewal: Refurbishment of anti‑contamination, corrosion‑resistant, or wear‑resistant coatings to improve surface durability and maintainability.

  • Documentation and validation: Measurement and performance reports covering geometry, surface quality, electrical properties, and vacuum sealing.

Common Failures & Solutions

  • Surface wear, scratches, contamination → Regeneration and cleaning restore surface quality and yield stability.

  • Flatness drift, particle release → Geometric correction, polishing, and optimized cleaning procedures.

  • Interface delamination, leakage → Re‑bonding and sealing rework, validated by leak data.

  • Electrode breaks/shorts, resistance drift → Conductive‑layer renewal and interface improvement to stabilize heating or signal paths.

  • Uneven heating, thermal lag → Thermal‑path tuning and sensor adjustment to improve ramp rate and uniformity.

  • Decline in clamping force or adsorption → Surface recovery and functional re‑testing to restore stable holding capacity.

Repair Workflow

RMA & NDA → Incoming inspection (flatness, roughness, geometry, visual, electrical, sealing/leak tests) → Failure analysis (FA) & repair plan (scope, risk, schedule, quotation) → Repair & optimization (machining, bonding, coating, cleaning, tuning) → Functional verification (clamping/adsorption, thermal uniformity, leak tests) → Delivery & tracking (measurement report, maintenance recommendations).

Quality & Confidentiality

  • Three‑stage QA: Incoming, in‑process, and outgoing inspections with retained samples and traceability.

  • Engineering changes & FAI: Documented milestone control ensures consistency before and after repair.

  • Measurement & reporting: Full documentation including geometry, roughness (Ra/Sa), electrical data, leak results, and functional testing.

  • Confidentiality: All design drawings, process parameters, and test data handled under NDA and strict data governance.

Lead Time & Benefits

  • Fast recovery: Localized processes shorten logistics and communication; urgent orders can be prioritized.

  • Cost efficiency: Repair and regeneration reduce downtime and procurement cost compared to full replacement.

  • Extended lifecycle: Optimized surfaces, interfaces, and thermal paths improve durability and maintainability.

  • Sustainability: Lower waste from one‑time replacement, supporting greener manufacturing.

Applicable Modules

  • ESC (Electrostatic Chucks) and heating platforms

  • Microporous vacuum adsorption platforms and positioning jigs

  • Ceramic carriers and structures for metrology/inspection

Our Differentiation

  • Materials + engineering integration: Cross‑disciplinary expertise in ceramic formulation, bonding, and precision machining to address diverse failure modes.

  • Data‑driven: Every step supported by measurable, traceable inspection data.

  • Localized supply: Reduced lead times and stronger supply resilience.

  • Long‑term support: Maintenance recommendations and upgrade roadmaps for sustained performance.

Call to Action

If you are experiencing issues such as surface degradation, leakage, uneven heating, or reduced clamping force, contact Fine Ceramic Plus today. Based on your target specs, operating environment, and constraints, we will deliver traceable, production‑ready repair and optimization solutions to stabilize yield, reduce downtime, and improve total cost of ownership (TCO).